Controlling Reflow Soldering Process through Detecting Circuit Boards

Throughout manufacturing of PC motherboards, reflow soldering is used to secure parts in place on printed circuit boards. Producers use presence sensing instantly after reflow soldering to start the next operation. They need special sensors to sense every motherboard as it passes out of the oven. These sensors must be able to operate reliably in an environment where the temperature may reach over 80̊C.
Inductive sensors are designed for this application.  Condist® technology offers best-in-class operating distances and sensors have a non-stop rating to 70°C. Trials showed quite stable performance even in the increased ambient temperatures around the reflow oven. Vacuum-encapsulated electronics warrant amazing resistance to vibration and thermal shock.

The sensing distance is set at 10mm, removing the danger of collision with parts on the board, and an M12-threaded metal housing lets simple positional adjustment if needed.